ASMPT Singapore and Tata Electronics have signed a pact to establish semiconductor assembly equipment infrastructure and solutions for its chip packaging units in Assam and Karnataka.
ASMPT will work together with Tata Electronics on workforce training, advancing service engineering infrastructure, automation, and spare supports, and boosting R&D initiatives in wire bond, flip chip, advanced packaging, and integrated system packaging.
“In a significant step towards accelerating its readiness for its semiconductor assembly and test facilities in Vemagal, Karnataka and Jagiroad, Assam, Tata Electronics signs a Memorandum of Understanding (MOU) with ASMPT Singapore to collaborate on establishing semiconductor assembly equipment infrastructure and solutions”, Tata Electronics said in a statement.
Tata Electronics is investing ₹27,000 crore in a chip assembly plant in Assam, which is expected to become operational next year. It also has a small chip assembly unit set up in Karnataka.
“This partnership will emphasize the development of essential training programs and advanced research and development, while also nurturing a vibrant ecosystem within the country”, Tata Electronics Managing Director and CEO Randhir Thakur added.
The partnership will also focus on energy and material efficiency to promote sustainable growth and strengthen the semiconductor supply chain ecosystem.
“We are excited to partner with Tata Electronics to realize their vision of establishing a global electronics supply chain in India. By leveraging our collective expertise and resources, we are well-positioned to drive significant progress in the semiconductor industry”.
“This collaboration will not only propel technological innovation but also cultivate the talent required for sustained future growth”, ASMPT, Group CEO, Robin Ng said.
Tata Electronics is setting up two major chip units comprising a Semiconductor Assembly and Test (OSAT) Facility in Jagiroad, Assam, and a semiconductor fab in Dholera, Gujarat.