China’s Yangtze Memory Technologies Co. (YMTC) unveiled a new memory chip technology that helps it close the gap on rivals including America’s Micron and South Korea’s SK Hynix.
Wuhan-based YMTC’s fourth-generation 3D NAND chip, the X3-9070, is the first to feature 232 layers of memory cells, according to the report.
SK Hynix has already developed its first 238-layer memory chip, boasting a new industry benchmark, while Micron last month said it plans to start mass production of its 232-layer chip by the end of the year
Industry experts say that while YMTC is unlikely to launch mass production of the chip anytime soon, it nevertheless marks a breakthrough for the company. A YMTC spokesperson declined to comment on the report.