Taiwan Semiconductor Manufacturing Co. (TSMC) revealed that commercial production of its eagerly awaited A14 process is set to commence in 2028.
A report from Focus Taiwan indicates that this announcement represents the forthcoming significant advancement in advanced semiconductor production as the worldwide chip supply chain strives to fulfill escalating technological requirements.
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The timeline presents an ambitious plan for the globe's biggest contract chip manufacturer. During a recent investor conference, TSMC Chairman C.C. Wei mentioned that the A14 process signifies the second generation of the company's nanosheet transistor technology.
As per the news article, Wei offered detailed engineering standards for the next technology node. He mentioned that in contrast to the 2-nanometer process, the newest technology the company has implemented on a large scale, the A14 process is anticipated to provide a 10-15 percent increase in speed while maintaining the same power consumption.
Conversely, the firm expects the node to achieve a 25-30 percent reduction in power at identical speeds, while the updated process is projected to enhance logic density by nearly 20 percent.
The production volume for this upcoming node is expected to exceed earlier versions. Wei highlighted that the production scale of the A14 process will surpass that of the 2nm process, which is anticipated to reinforce TSMC's advantage over its competitors in technology advancement.
Looking further into the future, the company noted that its roadmap spans well into the next decade. Wei stated that TSMC plans to initiate commercial production of the advanced A13 and A12 processes in 2029, following the A14 process.
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At the same time, TSMC is advancing another IC assembly method alongside the widely utilized Chip-on-Wafer-on-Substrate (CoWoS) technology, which is in great demand for AI applications in the global market, Wei mentioned.
As per the news reports, TSMC requires approximately one year to transition the new IC assembly technology to commercial production, which is anticipated to reduce its operating expenses, he mentioned.
Due to the limited availability of CoWoS services, TSMC is making every effort to bridge the gap between supply and demand, Wei noted.
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TSMC will be pleased to observe increased investments from more manufacturers in advanced IC assembly technologies, allowing for greater flexibility in production planning for clients, he stated.